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PRODUCT
VIGON SC200 Water-based stencil cleaner for the removal of solder pastes and SMT adhesives

VIGON® SC 200 is a water-based cleaning agent designed to clean SMT stencils at room temperature. Based on the MPC® Technology, the cleaning agent reliably removes solder pastes and SMT adhesives in one single process and can also be used for stencil underside wiping in printers. It is designed for the use in spray-in-air and ultrasonic cleaning systems and is also recommended for cleaning misprinted solder paste. Depending on the type of fluxes, VIGON® SC 200 can also be used for misprints on double-sided PCBAs with one side already soldered.

  • Areas of application – Stencil & Misprint Cleaning

  • Advantages compared to other cleaners

    • High bath loading capability, very good filterability and therefore a long bath life as well as low maintenance costs.

    • Due to its mild formulation, the medium shows excellent material compatibility with stencils.

    • Applicable in spray-in-air systems, ultrasonic dip tanks and printers.

    • Recommended for ambient cleaning temperatures.

    • Water-based cleaner without flash point, no explosion-proof protection required.

    • Applicable in closed-loop systems.

    • No foaming when used in spray-in-air systems, low odor, no building of organics in the rinsing section.

    • VIGON® SC 200 has been approved by leading international manufacturers for the use in their stencil printers. Written approvals can be obtained from ZESTRON.

Process Steps
Cleaning Process
1. Cleaning
2. Rinsing
3. Drying
Spray-in-air VIGON® SC 200 VIGON® SC 200, water or DI-water* Hot air or circulating air
Ultrasonic VIGON® SC 200 VIGON® SC 200, water or DI-water* Hot air or circulating air
SMT printer VIGON® SC 200 not applicable vacuum drying

*Depending on the water hardness, rinsing with regular water might be sufficient for stencil cleaning. In the case of high water hardness,
lime marks may stay behind. For misprint cleaning, rinsing with DI-water is highly recommended.

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Technical Data*
Density (g/ccm) at 20°C/68°F 0.99
Surface tension (mN/m) at 25°C/77°F 29.7
Boiling range °C/°F 95 – 212 / 203 – 414
Flash point °C/°F None until boiling
pH value 10g/l H2O Neutral
Vapor pressure (mbar) at 20°C/68°F 18.1
Cleaning temperature °C/°F 20 – 50 / 68 – 122
Solubility in water - Soluble
Application
concentration
Ready-to-use Pure
Application
concentration *1
Concentrate 10 - 25 %
HMIS Rating Health-Flammability-Reactivity 1 - 0 - 0

* Please note that the information above represents ATRON® SP 300 as a ready-to-use mixture.
*1 ATRON® SP 300 concentrate has to be diluted in DI-water.

Product Features & Cleaning Standards

  • 100% compliance with EU guidelines (RoHS 1, 2 & 3, WEEE)

  • Extensively tested and suitable for cleaning lead-free solder pastes

  • MPC® Technology ensures an extremely long bath life when used in a closed loop system

  • Product is free of any critical substances according to SIN & SVHC lists

Stencils cleaned with VIGON® SC 200 in a ZESTRON specified process meet the following industry standards:

  • IPC-7526 Manual for cleaning of stencils and misprinted boards

Environmental, health & safety regulations

  • VIGON® SC 200 is formulated free of any halogenated compounds and biodegradable.

  • Rinsing with water is not necessary. This results in the elimination of water streams and water treatment processes.

  • Refer to the SDS for specific handling precautions and instructions.

  • VIGON® SC 200 is a non-hazardous material and according to EU standards does not require specific labelling.

Availability & Storage

  • Available as concentrate and ready-to-use solution.

  • Store VIGON® SC 200 in the original container at a temperature between
5 - 30°C / 41 - 86°F.

  • The product has a minimum shelf life of 5 years in factory sealed containers.require specific labelling.

Further product information

  • Material Compatibility

    Please review the Material Compatibility overview before using the cleaning agent.

  • Evaluation guideline

    Guideline for stencil underside wiping in SMT printers.

  • Process reliability

    Additional information about underside cleaning in SMT printers.

  • MPC® Technology Sheet

    Detailed information on MPC® Technology.

  • Filter recommendation

    To take full advantage of MPC® Technology and further extend the bath life of VIGON® SC 200, filtration is recommended.

  • Safety Data Sheet

Available Process Optimization –Products

To ensure a stable running cleaning process, it is important to monitor cleaning agent concentration and regular bath treatment. For VIGON® SC 200 a variety of process support products is available
  • Concentration measurement:

    • ZESTRON® EYE for automated real-time concentration monitoring providing 100% traceability.

    • ZESTRON® Bath Analyzer 20, a manual test method for fast and reliable checks on cleaner concentration.

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