VIGON® UC 160 is a water-based cleaning agent specifically designed to remove solder paste from stencils in SMT printers. It has an excellent wetting ability on the fabric, which leads to an improved cleaning performance and thereby reduces smearing on the stencil underside significantly. This in turn prevents solder paste bridging on boards and ensures good and reliable printing results. VIGON® UC 160 is also an ideal replacement for Isopropanol due to excellent health and safety characteristics.
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Areas of application – Stencil underside wiping in SMT printers
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Advantages compared to other cleaners
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VIGON® UC 160 effectively removes the latest lead-free & lead-based solder pastes from stencils in underside wiping, even out of fine pitch apertures.
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The cleaner is specifically suitable for print after wait.
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Provides excellent wetting ability on stencils and therefore increased cleaning performance, which significantly reduces smearing on the stencil underside. Thus, bridging of solder paste on the boards can be avoided.
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Good delineation stability further ensures reduced solder balling.
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High operational safety and ideal replacement for Isopropanol due to excellent health and safety characteristics, no flash point, low VOC level.
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VIGON® UC 160 has low odor.
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The product has been approved by leading international manufacturers for the use in their stencil printers. Written approvals can be obtained from ZESTRON.
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| Process Steps | |||
|---|---|---|---|
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Cleaning Process
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1. Cleaning
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2. Vacuum
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3. Drying
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| SMT printer | VIGON® UC 160 | Fabric | Fabric |
Machine Test Center
Analytical Center
| Technical Data* | ||
|---|---|---|
| Density | (g/ccm) at 20°C/68°F | 1.00 |
| Surface tension | (mN/m) at 25°C/77°F | 43.1 |
| Boiling range | °C/°F | 100 – 190 / 212 – 374 |
| Flash point | °C/°F | None until boiling |
| pH value | 10g/l H2O | Neutral |
| Vapor pressure | (mbar) at 20°C/68°F | Approx. 21.0 |
| Cleaning temperature | °C/°F | Room temperature |
| Application concentration |
Ready-to-use | Pure |
| HMIS Rating | Health-Flammability-Reactivity | 0 - 0 - 0 |
Specifications and appearance are subject to change without notice for improvement.
Product Features & Cleaning Standards
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100% compliance with EU guidelines (RoHS 1, 2 & 3, WEEE)
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Extensively tested and suitable for cleaning lead-free solder pastes
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Product is free of any critical substances according to SIN & SVHC lists
After cleaning the underside of SMT stencils used for production with VIGON® UC 160, PCBs meet the requirements of the following standard:
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IPC-9202 Material and Process Characterization/Qualification
Environmental, health & safety regulations
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VIGON® UC 160 is water-based and biodegradable
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The cleaning agent is formulated free of any halogenated compounds.
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The product is a non-hazardous material and according to EU standards does not require specific labeling.
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Refer to the SDS for specific handling precautions and instructions.
Availability & Storage
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Available as ready-to-use solution.
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Store VIGON® UC 160 in the original container at a temperature between 5 - 30°C / 41 - 86°F.
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The product has a minimum shelf life of 5 years in factory sealed containers.
Further product information
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Material Compatibility
Please review the Material Compatibility overview before using the cleaning agent.
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Evaluation guideline
Guideline for stencil underside wiping in SMT printers.
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Process reliability
Additional information about underside wiping in printers.
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Safety Data Sheet
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